10 Must Attend Technical Sessions at SEMI-THERM 35
The 35th Semiconductor Thermal Management conference starts in a week and is being held in Silicon Valley, CA. Electronics Cooling is one of the media sponsors and will have an exhibit booth –stop by...
View ArticleManaging Cooling Fan Noise In Product Design
ABSTRACT Cooling fan noise is a system property determined as much by thermal and mechanical design and fan selection as by a fan’s acoustical design. While even the quietest fan can be used in a noisy...
View ArticleUsing Electrical Capacitance to Evaluate the Thermal Mechanical Stability of...
BY: Lauren Boston, Andrew Yu, Timothy Chainer, Edward Yarmchuk, and Michael Gayness To improve cooling of electronic components, a heat spreader is typically attached to the component to spread the...
View ArticleLaird Introduces IceKap™ P30000, a Novel, Non-Silicone, High Performance...
Improving Thermal Performance and Device Reliability September 5, 2019 – Cleveland, Ohio, USA – Laird Performance Materials, a global manufacturer enabling and protecting sensitive electronics,...
View Article125-19(SP)C-A Flexible, Non-flammable, High Conductive Temperature Resistant...
Ayer, MA, October 2019 Creative Materials introduces 125-19(SP)C, a flexible, non-flammable, high temperature resistant conductive ink and coating. This product features excellent bonding to most metal...
View ArticleLow Compression Force Sarcon
Carteret, NJ — The compression characteristics of thermal gap fillers should be key considerations during a product’s early design phase. For applications that have delicate components or widely...
View ArticleUnderfill Epoxy Offers Thermal Conductivity and Electrical Insulation
Product: EP29LPTCHT Release Date: 11/21/2019 Master Bond EP29LPTCHT is a two component, low viscosity epoxy compound that can be effectively utilized for underfill and encapsulation applications. It...
View ArticleTough Epoxy Polysulfide Adhesive Resists High Temperatures
Product: EP21TPHT Release Date: 01/14/2020 Master Bond EP21TPHT is a new two component epoxy polysulfide system designed for bonding applications that require toughened and thermally stable bonds...
View ArticleCool Information from Fujipoly
Carteret, NJ —Tuesday, January 21, 2020— Fujipoly recently added an Engineering Resource section to its website. This technical information library gives engineers unrestricted access to useful...
View ArticleThermal Management of Chip-on-Board LED Systems and Their Aging Response to...
By: Lisa Mitterhuber, Julien Magnien, Elke Kraker Introduction Twenty years ago, a lamp had exactly one purpose—to illuminate the room. A typical incandescent lamp lasted a year and failure was caused...
View ArticleNASA Low Outgassing Rated Epoxy Features Enhanced Chemical Resistance
Product: EP42-2LV Black Release Date: 05/11/2020 EP42-2LV Black is a two-part epoxy with low viscosity and good flow. It withstands prolonged immersion in many acids, bases, solvents, fuels and oils....
View ArticleHeilind Electronics and Laird Performance Materials Sign Global Distribution...
Heilind Electronics, a leading distributor of electronic components, announced today the signing of a global distribution agreement with Laird Performance Materials, a portfolio company of privately...
View ArticleThermally Conductive Dispensable Silicone-free Gap Filler, up to 7.5 W/m∙K
This highly conformable and thermally conductive compound is a high performance, one component, dispensable silicone-free compound. It has been developed through a Eurostars funded program—SIGNIFICANT,...
View ArticleLaird Performance Materials’ New Electrically Conductive Elastomers for...
Materials enhancements in two new electrically conductive elastomers from Laird R&F Products eliminate the risk of galvanic corrosion and damage from fuel, oils, and deicing fluids in military and...
View ArticleParker’s THERM-A-GAP GEL 37 Is the Next Generation of Single Component...
Parker’s THERM-A-GAPTM GEL 37 Is the Next Generation of Single Component Dispensable Thermal Interface Materials Offers improved flow rate control and higher thermal conductivity than THERM-A-GAP GEL...
View ArticleTwo-Component Room Temperature Curing Thermally Conductive And Electrically...
Ayer, MA, August 2020 New Product – Creative Materials introduces 813-76, a two-component room temperature curing thermally conductive and electrically insulating adhesive. This product is designed...
View ArticleThermally Conductive Epoxy for Large Potting Applications Features Low Exotherm
Product: EP29LPAOHT Release Date: 08/18/2020 Master Bond EP29LPAOHT is a two-component, NASA low outgassing approved epoxy system featuring a long working life of 8-10 hours per 1,000 gram batch. Due...
View ArticleSetting the Standard for TIMs
Carteret, NJ —Tuesday, September 22, 2020— To accommodate diverse thermal cooling requirements, Fujipoly® offers (4) formulations of Standard Performance Gap Filler Pads. Each of the products in the...
View ArticleHeat-Blocking Defects Detected Acoustically
In the landing gear control module of an aircraft, a high-voltage IGBT is about to fail. In the solder bonding one chip’s ceramic base to its heat sink are three small air bubbles—voids, in the...
View ArticleBergquist® Liqui-Form TLF 6000HG Thermal Gel Earns Industry Award
Irvine, California – Last week, Henkel was honored with yet another industry award for its thermal interface material (TIM) ingenuity. BERGQUIST® Liqui-Form TLF 6000HG received a Global Technology...
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