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Thermal Quality Assessment of Semiconductor Components

Introduction Reduction in early life failures and continuous quality improvements are “table stakes” for semiconductor manufacturers servicing the automotive industry. “Industry analysts expect that...

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Emerging 5G Networks: Potential Economic Benefits of Two-Phase Thermal...

The fourth and future industrial revolutions will set new requirements for smart cities / factories, autonomous vehicles, augmented reality, smartphones, etc., resulting in more distributed...

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Upper Air Room Disinfection with UV-C Luminaire – Metrics and Multi-Domain...

In my previous article, I questioned how our simulation community of experts can contribute in this pandemic time? I am coming back to present examples of contributions. While the general topic of this...

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Future Trends in LED Driver System Modeling

Introduction A decade ago, the major players in the lighting industry decided to make the transition to digital systems and set the pace in connected lighting. At present, only a few companies can...

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Electrically Conductive Die Attach Adhesive Has Very High Thermal Conductivity

In this video demonstration, learn more about EP3HTSDA-1, a thermally conductive die attach epoxy, and see how easily it dispenses. One component Master Bond EP3HTSDA-1 is formulated primarily for die...

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Machine Learning Optimization to Boost the Effectiveness of Phase Change...

Written by: Dr. Amy Marconnet and Meghavin Bhatasana – Purdue University Although miniaturization of electronic components has helped advance computing power and accelerated technology development, it...

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Statistics Corner: Weibull Distribution

A little over a pandemic ago, the first article in this series on statistical analysis mentioned that a fundamental aspect of statistics is that one assumes a mathematical model that describes the...

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Thermal Modeling of a Silicon Germanium (SiGe) Radio Frequency Integrated...

The creation, transport and storage of digital information are growing at rates of 40% to 50% annually, with video, mobile broadband, and machine-to-machine communication being the main drivers. The...

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Utilizing Laser Flash in Combination with Finite Element Modeling to Analyze...

Abstract The utility of the laser flash thermal conductivity measurement can be greatly expanded to more complex structures by modeling laser flash results using Finite Element Models. This approach is...

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Summary of the IEEE ITherm 2023 Conference

The IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) was held at the JW Marriott Grande Lakes, Orlando, FL, May 30 – June 2, 2023. This was the 22nd...

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