Gap Filler Thermal Interface Material for Silicone-Sensitive Electronic...
The Bergquist Company, a supplier of thermal management materials, has released Gap Filler 1500LV, a new “low volatility, two-component, liquid-dispensable thermal interface material that offers the...
View ArticleThermally Conductive Acrylic Interface Pads
Electronic component distributor Digi-Key has announced the availability of 3M’s 5590H series thermally-conductive acrylic interface pads for effective heat transfer and vibration dampining in...
View ArticleNew Multi-Tasking Robot Platform for Thermal Grease Dispensing Applications
Automated liquid dispensing equipment provider Fisnar has announced the release of a new multi-tasking robot designed to assist with safe and secure dispensing applications ranging from miniature SMT...
View ArticleNew Low Resistance TIM Delivers 6.0 W/m°K Thermal Conductivity
Thermal interface material provider Fujipoly has released Sarcon GR45A-00, a very low modulus thermal interface material with a low thermal resistance. Featuring a thermal conductivity of 6.0 W/m°K per...
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Thin Film Thermal Conductivity Measurement using a Micropipette Thermocouple
R. Shrestha, K. M. Lee and T. Y. Choi – University of North Texas D. S. Kim – POSTECH INTRODUCTION Due to the required experimental characterization complexity for the thermal conductivity...
View ArticleNew Low-Thermal Resistance Gap Filler Pad
Fujipoly has released new Sarcon GR25A-0H2-30GY, a 0.3mm thick, low thermal resistance interface material with a low-tac surface on both sides. According to the company, the material’s new formulation...
View ArticleNanodiamond Filler Ups Conductivity of Thermally-Conductive Polymers
Carbodeon, a supplier of superhard materials such as nano-diamonds and graphitic carbon nitride, has released a new thermally-conductive nanodiamond filler it claims increases the conductivity of...
View ArticlePatent for Thermal Interface Material with Thin Transfer Film or Metallization
The U.S. Patent and Trademark Office has awarded patent No. 8,545,987, “Thermal Interface Material with Thin Transfer Film or Metallization” to Laird Technologies, Inc. of Earth City, Mo., USA....
View ArticleFlexible Thermal Absorbing Films Boost Heat Dissipation in Small Electronics
Manufacturing company Henkel has released Loctite TAF, a new thermal absorbing film designed to address the heat management challenges associated with small but high-functioning handheld electronic...
View ArticleNew Gap Filler Offers Thermal Conductivity of 1.3W/m-K
The Bergquist Company has released the Gap Pad 1450 thermally-conductive gap filler. Designed to provide low strain on fragile components, the new gap filler is ideal for a variety of applications,...
View ArticleNew Dispensable Thermal Pads Offer Improved Heat Management, Greater...
Dow Corning, a developer of silicon-based technology, has introduced new Dow Corning Dispensable Thermal Pads for use in LED, data server, telecommunications equipment and transportation thermal...
View ArticleCarbon Nanotubes Offer Thermal Stress Relief at Critical Juntions
Scientists at Stanford University have released new findings that demonstrate the benefits of using carbon nanotube arrays at critical junctions between two materials to help better relieve thermal...
View ArticleHighly-Conformable Gap Filler Pad with Reinforced Mesh Center
Fujipoly America Corporation has released its new Sarcon25GR-T2d thermal interface material, a soft, highly-conformable gap filler pad with a reinforced mesh center ideal for applications that require...
View ArticleNew Ultrathin Material May Lead to Better Thermally Conductive Coatings
Scientists at Kansas State University have discovered a new ultrathin electrically conductive material they say may lead to advances in the efficiency of electronic and thermal devices. Vikas Berry,...
View ArticlePCMA Thermal Interface for Intel Core LGA-115x Processors
Liquid cooling product manufacturer EK Water Blocks has released EK-TIM Indigo XS, a thermal interface material for Intel Core LGA-115x processors. Unlike greases, metallic thermal interface pads or...
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Carbon Nanotubes Boost Microprocessor Cooling
(Left to Right) Brett Helms, Frank Ogletree and Sumanjeet Kaur at the Molecular Foundry used organic molecules to form strong covalent bonds between carbon nanotubes and metal surfaces, improving by...
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Towards Reproducible ASTM D5470 Measurements at Lower Cost
Baratunde A. Cola Georgia Institute of Technology INTRODUCTION ASTM D5470 (updated to ASTM D5470-12 in 2012) [1] remains an industry standard for characterizing thermal interface materials (TIMs)...
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Ultra-Thin Titanium Based Thermal Solution for Electronic Applications
Payam Bozorgi and George Fleischman PiMEMS, Inc. Introduction As electronic system technology advances with continual increases in requirements leading to greater demand for higher power consumption,...
View ArticleThermal Pad Offers Advantages of Thermal Grease Without Mess
AOS Thermal Compounds has released Micro-Faze, a new thermal interface material formulated with non-silicone thermal grease. Micro-Faze offers a number of technical advantages, including low thermal...
View ArticleExpanded Product Catalog Features New Thermal Interface Materials
Fujipoly has released its new thermal interface material and elastomeric connector product catalog. The 52-page product overview and technical guide includes design guidelines as well as detailed...
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